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Han’s Laser Technology Industry Group Co., Ltd, Copyright © GuangDong ICP No. 05013795 Copyright Notices

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HDZ-WUVC100

特徴
1. With 355nm UV laser, the cutting machine has stable performance, good light spot, and long-time stable operation
2. The reliable and high-precision X-Y-Z-θ worktable and excellent accelerating and decelerating performance can efficiently improve the unit time productivity of system 
3. Through vacuum absorption, the wafer cannot move during platform moving
4. The wafer can be positioned through positioning the Mark point on the wafer, which can ensure the cutting precision
5. The high-efficient and flexible software operation system has a simple and concise interface
6. Automatic loading and unloading, robot carrying and automatic edge searching function
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Product description

Application:

Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing

 

Specification:

Machine model

HDZ-WUVC100

HDZ-WUVC200

Laser power

15W

15W

Laser wavelength

355nm

355nm

XY axis repeated positioning precision

±1µm

±1µm

θ axis repeated positioning precision

±15s

±15s

Cutting line width

>15µm

>15µm

Cutting depth

>25µm

>25µm

Cutting speed (*The cutting speed varies from different products)

100mm/s

100mm/s

Loading and unloading mode

Manual

Robot carrying; automatic edge searching

Processing product type

2 inch-12 inch wafers

2 inch-12 inch wafers

Power supply

AC 220V,50Hz

AC 220V,50Hz

 

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暂未实现,敬请期待
暂未实现,敬请期待